Real projects, details under NDA.

A stackable flight controller platform needed to fit a high-pin-count BGA processor, a secondary co-processor, and fully redundant sensor paths into a compact, mezzanine-style 3-board architecture — without compromising signal integrity or serviceability.

An 8-layer board built around an STM32H7-class BGA processor paired with an STM32F103 co-processor, with redundant IMU and sensor paths for fault tolerance. Designed to Pixhawk DS12 mechanical and connector standards, and built DFM-ready for direct submission to JLCPCB.

An existing aviation-grade 12V-to-28V DC-DC converter, designed by a previous vendor, was failing in the field. The client needed root-cause analysis and a redesign before further units shipped.

Investigation traced the primary failure to undersized pads on a 2512 shunt resistor, compounded by a footprint mismatch, incorrect fuse pad sizing, a BOM value conflict, and thermal and vibration weaknesses. We redesigned the affected sections to resolve each issue and brought the board up to aviation-grade reliability standards.

A fan speed controller using an LTC6992-class timer IC was misbehaving in the field — speed control was erratic and didn't track the intended input range.

Root cause was a potentiometer voltage range incompatible with the controller IC's MOD pin input range, compounded by an inverted transfer function in the specific IC variant used. We corrected the input scaling and IC variant selection to restore proper, linear speed control across the full intended range.